This machine is designed for 300mm CMP R&D use.The wafer loading and unloading is by manual.The polishing recipe and sequence can be programmed by PLC.The high flexibility performance provides you high availability for your R&D items.

We designed special CMP tool for diversified MEMS process requirement.
The new designed carrier can applied extremely low down force control.The detail specification will be determined bases on customer's requirement.Work size is φ3" to φ6".

This machine bases on other large CMP machines, and is a high rigidity that makes a clear distinction.An experiment near the mass production device is possible according to various options.It is domination in the cost performance.

Specification
1.Platen diameter 380mm
2.Platen thikness 25mm
3.No.of revolution 10 to 80 rpm

This double face machine is 4way style.It is designed in Japan and manufactured in China.
So, it is achieved high quality and low price. We produce 9B to 24B.Japanese side carry out the maintenance with responsibility.

Standard specification
1.Each spindle is stepless speed change
2.Stepless pressurize system
3.Internal gear automatic up and down
4.Each spindle can spin the opposite way
5.4motor for each axels

The Feature
Well-suited to grind the thick substrate.
Less damage to work piece in grinding process.
Available to grind materials onward to much high-caliber thickness that other machine has ever done.
The axis of the diamond wheel goes back and forward movement allows the machine more damage less grinding.Because it lets slip stress of the grinding.
Automatically measures the thickness of material,re-check the thickness, and get final grinding.The operator need no measuring and re-calculation of thickness until target thickness.
It is the most suitable for the back grinding of the splintery substrate as Sapphire,GaN,GaAs,SiC and Silicon Wafer.

Specification
1.Maximum work size φ200mm
2.Maximum grinding stone φ200mm
3.Grinding wheel No. of revolution 2200rpm
4.Work spindle No. of revolution 400 rpm

By adoption of a direct-current brash less motor,the invrease in pressure loss of a HEPA filter is detected, and fan outputs is raised.So this clean bench keeps blow-off wind velocity constant automatically.It achieved long-life of HEPA filter compared with former type.

Separation of the sludge in the coolant takes time.And if you let it alone, the sludge becomes hard and scratches the workpiece.
This Centrifugal Coolant Separator removes the sludge automatically.
Separated sludge is discharged into the drum.So it doesn't take time, and is very convenient.